Intel unveils Foveros 3D chip stacking and new 10nm ‘chiplets’

An Architecture event hosted this week this week, Intel described an unusually exquisite strategy for the development of future processors, most of which by the end of 2017, the Intel's Biggest in individual, stickable "chutes" In the goals, different safeguards will keep rotating different elements. What is the offer to offer products that are called 3D Stacking: An industry-based industry-processing process components. We have already seen memory stack;

Now, doing something similar to the Intel CPU, this designers leave the dead processing in addition to deadly chip except for additional processing. So you can create separate separate chats on mini-memory, power regulatory, graphics, and e-processing.

Intel unveils Foveros 3D chip stacking and new 10nm ‘chiplets’

Some of which can be stocked together. The advantages of more computing density and elasticity are clear, but this modular approach Intel skirt helps one of its biggest challenges: Build 10nm scale full chips.

Intel's last 10 million meters of maps are constantly and frequently flipped, and the reason for ensuring that the company faces poorly engineering challenges on the project. In an October report by SemiAccurate it has also been said that Intel has completely canceled its 10nm projects, although the older champion rejected the rumor and said "is progressing well at 10nm .

" Both of course, in fact, both of them are correct, in the way of the new discovery of the Furorosaur decision decided by Intel, Intel shows that it will do something like 2 stacking, in which the separation of different processor components The relationship is in small chats, each of which can be developed using different production nodes. Thus, Intel can provide approximately 10 ncc standby, despite which 14nm and 22nm chipple modules (as shown in the graphic below) will be displayed within them.

To remember this, without a new micro codenium, an Intel will not be announced, in which, in this example, is called "Sunni Wei". Sunny corner will be in the last half of the next generation core and poison processor Intel. The next year, and Intel have made some of the common promises that its delay can be improved and it can be set up parallel with multiple operations (thus working like GPUs). In front of the graphics, Intel's new Gen11 integrated graphics are "designed to break 1 TFLOPS barrier," which will be part of 2019 "10nm based" processors. One thing that has shown no change in Intel's plans is intended to introduce contrary graphics processor by 2020.

Multiple important questions do not answer. Will Foveros 3 part of the 3D stick chips of the Sunny Cowboys race, or will it be completely different?

Will we find Folder and Tablets as well as folder stops chips in predicted laptops and desktops? We have presented these and other questions to the Intel representatives, but the companies will only call

"everything from the mobile devices to the data center" that the Foveros processor will begin in the second half of the next year. Intel's historical failures with smartphone chips, and now we have reliable tablets and other types of other rates, it is most likely that the new processors will be targeted in the same classes of the device in which Intel The business is already running.

From today's announcements it clearly shows that Intel is busy repeating and reorganizing a number of its design and strategy designs. One company can not expect that this year, Raja Kodiyuri got a new key architect from archival MDD this year. The Codeary AMD had a great personality, and she clearly plays the same role in steering in the future direction of Intel.


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